Q2 2025 semiconductor demand and supply chain dynamics - patterns

Type: Signal Mosaic

Period: 2025Q2

- totalcompaniesanalyzed: 18 - strongestconsensus: CoWoS and advanced packaging capacity is the binding constraint for AI infrastructure through at least H1 2025, with equipment suppliers to this bottleneck capturing disproportionate profit pools - biggestdivergence: Equipment company guidance diverges sharply by exposure: HBM/advanced packaging equipment Lam, ASMPT shows strength while China-exposed and generalist equipment ASM International, Merck KGaA, Aixtron shows deterioration. This is not

Q2 2025 semiconductor demand and supply chain dynamics - patterns | Silicon Signal