Q3 2025 semiconductor demand and supply chain dynamics - patterns

Type: Signal Mosaic

Period: 2025Q3

- totalcompaniesanalyzed: 28 - strongestconsensus: Advanced packaging is the binding constraint for AI infrastructure through 2025-2026, creating temporary pricing power for incumbents and equipment demand for the build phase. This consensus spans bull, bear, and contrarian frameworks. - biggestdivergence: AI demand quality and durability. Bull case treats $110B AVGO backlog and TSMC capacity constraints as evidence of sustainable structural demand. Bear case identifies customer concentration 3-